[PDF.43op] Handbook of 3D Integration: Technology and Applications of 3D Integrated Circuits (2 Vol. Set)

Handbook of 3D Integration: Technology and Applications of 3D Integrated Circuits (2 Vol. Set)

[PDF.ql61] Handbook of 3D Integration: Technology and Applications of 3D Integrated Circuits (2 Vol. Set)

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 | #5052241 in Books |  2008-10-21 | Original language:English | PDF # 2 |  9.55 x.79 x6.95l,4.05 | File type: PDF | 798 pages

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||1 of 1 people found the following review helpful.| many ideas for greater circuit densities|By W Boudville|This first volume in its series gives a very readable survey of many methods used to make advanced 3d chips. Here, some of the push to 3d is simply to increase the effective 2d capacity of the chips. Hence deeper layers, vias and other structures. Many TEM photos are given, which greatly helps the reader understand what is|From the Back Cover|The first encompassing treatise of this new and very important field puts the known physical limitations for classic 2D microelectronics into perspective with the requirements for further microelectronics developments and market necessities.

The first encompassing treatise of this new, but very important field puts the known physical limitations for classic 2D electronics into perspective with the requirements for further electronics developments and market necessities. This two-volume handbook presents 3D solutions to the feature density problem, addressing all important issues, such as wafer processing, die bonding, packaging technology, and thermal aspects. It begins with an introductory part, which defin...

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